Palm Pre Teardown

[::Hitesh:: 1,763]

There are some pretty interesting things that popped up on the Pre's PCB's. This is the first production device we've seen on the OMAP3 (Open Media Applications Processor) platform. OMAP3 is powered by the 600MHZ ARM Cortex A8, PowerVR SGX 530 (GPU), 430MHz C64x, DSP and ISP (Image Signal Processor) and was clearly designed to pack a punch

On the connections side we see the usual wifi/bluetooth combo going to Marvell and CSR with the W8686 and 63823 respectively. We also see the BaseBand win going to Qualcomm with the heavily integrated MSM6801A platform. The OMAP3 PMIC comes loaded with a USB tranceiver and Audio codec which even further reduces the overall board density of this device. We're not fully sure – but it looks as if the Pre's cool new multi-touch Touch Screen Controller win went to Cypress Semiconductor with the CP6944BA device.

The device packs a 1150mAh battery

On the top of the communications board we can spot the BaseBand Processor (Qualcomm MSM6801A), SDRAM, RF power amp and Duplexer by TriQuint.

On the bottom of the communications board we can spot the BaseBand PMIC (Maxim MAX8695Q), RF Transmitter (RFT6150) and the RF Tranceiver (RFR6500) both by Qualcomm.

On the main logic board, we see the OMAP3 PMIC – the Texas Instruments TWL5030. As mentioned before, this PMIC is packed with a USB Traceiver as well as Audio Codec. We also see the Bluetooth and Wifi Tranceivers with the earlier discussed wins from both Marvell and CSR. This device contains a microUSB port and 8GB of internal memory from Samsung.

Elpida offers up some mobile DDR memory and is stacked on top of the venerable OMAP3 processor. We'll have to wait and see how this thing benchmarks.

Source

[kshah 452]

Very nice:

One of our rimweb member tried to open Pre but its very difficult to open and dis mental. I think all new phone might be same as now they rely too much on adhesives.

[Greatest 55]

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